Materials and Devices Integration

Integration Focus	Taskforces for Integration
Taking into account the crucial role that transistors play in any electronic or opto-electronic system, this work package within FlexNet will focus on the analysis of the most important steps of OTFT integration: synthesis of new (also multifunctional) materials modification and adjustment of interfaces barrier materials; unification of methods for material characterisation (which, if necessary, could be applied on-line) effective and environmentally friendly processing and materials integration	In order to achieve an impactful progress in the workpackage for the materials and devices integration, 6 taskforces (TF) have been implemented: TF1 - Organic Semiconductors with focus on OFTFs TF2 - Dielectrics and Conductors TF3 - Interface TF4 - Barrier Materials TF5 - Characterization of Materials TF6 - Processing and Devices Integration
Schematic example of integration steps

If you have any further questions, please feel free to contact:

Jacek Ulanski (Jacek.Ulanski@p.lodz.pl)